CRG0402200K 查看數據表（PDF） - TE Connectivity

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CRG0402200K

THICK FILM CHIP RESISTORS

TE Connectivity 

THICK FILM CHIP RESISTORS

Performance Specification: (Continued)

Characteristic Specification

Test Methods

(JIS C 5201-1)

Temperature Resistance change rate is

Resistance change after continuous

Cycling

5 cycles for duty cycle specified below :

± % . % + . Ω Max. Step

± % . % + . Ω Ma . 1

Temperature Time

-55°C±3°C 30 mins

2

Room Temp 10~15 mins

3

155°C±2°C 30 mins

4

Room Temp 10~15 mins

(Sub-clause 4.19)

Load Life in Resistance change rate is

Resistance change after 1,000 hours (1.5

Humidity

± % . % + . Ω Ma .

± % . % + . Ω Ma .

hours "on", 0.5 hour "off" ) at RCWV in a

humidity chamber controlled at 40℃ ± 2℃

and 90 to 95 % relative humidity

(Sub-clause 4.24.2.1)

Load Life

Resistance change rate is

Permanent resistance change after 1,000

± % . % + . Ω Ma .

± % . % + . Ω Ma .

hours operating at RCWV, with duty cycle

of (1.5 hours"on", 0.5 hour"off") at 70℃ ±

2℃ ambient

(Sub-clause 4.25.1)

Terminal

Resistance change rate is

Twist of Test Board :

Bending

± . % + . Ω Ma .

Y/X = 5/90 mm for 10 seconds

(Sub-clause 4.33)

The resistors of Ω o l a do the hara teristi oted of *

Environment Related Substance

This product complies to EU RoHS directive, EU PAHs directive, EU PFOS directive and

Halogen free. Ozone layer depleting substances are not used in our manufacturing

process of this product.

This product is not manufactured using Chloro fluorocarbons (CFCs),

Hydrochlorofluorocarbons (HCFCs), Hydrobromofluorocarbons (HBFCs) or other

ozone depleting substances in any phase of the manufacturing process.

Storage Condition

The performance of these products, including the solderability, is guaranteed for a

year from the date of arrival at your company, provided that they remain packed as

they were when delivered and stored at a temperature of 25°C ± 10°C and a relative

humidity of 60%RH ± 10%RH, chemical and dust free atmosphere

Even within the above guarantee periods, do not store these products in the

following conditions otherwise, their electrical performance and/or solderability may

be deteriorated, and the packaging materials (e.g. taping materials) may be deformed

or deteriorated, resulting in mounting failures.

1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S,

NH3, SO2, or NO2

2. In direct sunlight

1773204 Rev J 12/2018

Dimensions in

millimetres unless

otherwise specified

Dimensions Shown for

reference purposes only.

Specifications subject to

change

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