MKT1817215254G 查看數據表（PDF） - Vishay Semiconductors
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MKT1817215254G Datasheet PDF : 14 Pages
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Not for New Designs - Alternative Device: MKT370
www.vishay.com
MKT1817
Vishay Roederstein
HEAT CONDUCTIVITY (G) AS A FUNCTION OF (ORIGINAL) PITCH AND CAPACITOR BODY
THICKNESS IN mW/°C
Wmax.
(mm)
HEAT CONDUCTIVITY (mW/°C)
PITCH 5 mm
2.5
2.5
3.0
3.0
4.5
4.0
6.0
5.5
POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function
of the free ambient temperature.
The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film
Capacitors”.
The component temperature rise (T) can be measured (see section “Measuring the Component Temperature” for more details)
or calculated by T = P/G:
• T = component temperature rise (°C)
• P = power dissipation of the component (mW)
• G = heat conductivity of the component (mW/°C)
MEASURING THE COMPONENT TEMPERATURE
A thermocouple must be attached to the capacitor body as in:
Thermocouple
The temperature is measured in unloaded (Tamb) and maximum loaded condition (TC).
The temperature rise is given by T = TC - Tamb.
To avoid radiation or convection, the capacitor should be tested in a wind-free box.
Revision: 11-Jan-18
8
Document Number: 26032
For technical questions, contact: dc-film@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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