VEMD6110X01 查看數據表（PDF） - Vishay Semiconductors
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VEMD6110X01 Datasheet PDF : 7 Pages
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www.vishay.com
12
E=0
10
f = 1 MHz
8
6
4
2
0
0.1
18438
1
10
100
VR - Reverse Voltage (V)
Fig. 5 - Diode Capacitance vs. Reverse Voltage
1.2
1.0
0.8
0.6
0.4
0.2
21554
0
600
700
800
900 1000
λ - Wavelength (nm)
1100
Fig. 6 - Relative Spectral Sensitivity vs. Wavelength
0° 10° 20°
30°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
80°
0.6 0.4 0.2 0
94 8013
Fig. 7 - Relative Radiant Sensitivity vs. Angular Displacement
VEMD6110X01
Vishay Semiconductors
REFLOW SOLDER PROFILE
300
250 255 °C
240 °C
217 °C
200
max. 260 °C
245 °C
max. 30 s
150
max. 120 s
max. 100 s
100
max. ramp down 6 °C/s
50 max. ramp up 3 °C/s
0
0
19841
50 100 150 200 250 300
Time (s)
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 72 h
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 4, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
Rev. 1.1, 03-Jul-15
3
Document Number: 84179
For technical questions, contact: detectortechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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