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STP16CPC26MTR(2013) 查看數據表(PDF) - STMicroelectronics

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产品描述 (功能)
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STP16CPC26MTR
(Rev.:2013)
ST-Microelectronics
STMicroelectronics ST-Microelectronics
STP16CPC26MTR Datasheet PDF : 26 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Electrical ratings
2
Electrical ratings
STP16CPC26
2.1
Absolute maximum ratings
Stressing the device above the rating listed in the “absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 3. Absolute maximum ratings
Symbol
Parameter
Value
Unit
VDD
VO
IO
VI
IGND
ESD
fCLK
Supply voltage
Output voltage
Output current
Input voltage
GND terminal current
Electrostatic discharge protection HBM human
body model
Clock frequency
0 to 7
-0.5 to 20
90
-0.4 to VDD+0.4
1600
±2
30
V
V
mA
V
mA
kV
MHz
2.2
Thermal data
Table 4. Thermal data
Symbol
Parameter
Value
TA
TOPR
TSTG
Operating free-air temperature range
Operating temperature range
Storage temperature range
SO-24
-40 to +125
-40 to +150
-55 to +150
60
RthJA
Thermal resistance junction-case
(1)
TSSOP24
(2)
TSSOP24
85
37.5
QSOP24
72
1. According with JEDEC standard 51-7B.
2. The exposed pad should be soldered directly to the PCB to realize the thermal benefits.
Unit
°C
°C/W
4/26
Doc ID 18469 Rev 4

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