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MC33926(2014) 查看數據表(PDF) - Freescale Semiconductor

零件编号
产品描述 (功能)
生产厂家
MC33926
(Rev.:2014)
Freescale
Freescale Semiconductor Freescale
MC33926 Datasheet PDF : 27 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 3. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device. These parameters are not production tested.
Symbol
Ratings
Value
Unit
Notes
ELECTRICAL RATINGS
VPWR(SS)
VPWR(T)
Power Supply Voltage
Normal Operation (Steady-state)
Transient Overvoltage
VIN
V SF
IOUT(CONT)
VESD1
VESD2
Logic Input Voltage
SF Output
Continuous Output Current
ESD Voltage
Human Body Model
Machine Model
Charge Device Model
Corner Pins (1,9,17,25)
All Other Pins
- 0.3 to 28
- 0.3 to 40
- 0.3 to 7.0
- 0.3 to 7.0
5.0
± 2000
± 200
±750
±500
V
(1)
V
(2)
V
(3)
A
(4)
V
(5)
THERMAL RATINGS
TSTG
Storage Temperature
- 65 to 150
C
Operating Temperature
TA
Ambient
TJ
Junction
- 40 to 125
- 40 to 150
C
(6)
Notes
1. Device will survive repetitive transient overvoltage conditions for durations not to exceed 500 ms at duty cycle not to exceed 10%.
External protection is required to prevent device damage in case of a reverse battery condition.
2. Exceeding the maximum input voltage on IN1, IN2, EN, INV, SLEW, D1, or D2 may cause a malfunction or permanent damage to the
device.
3. Exceeding the pull-up resistor voltage on the open drain SF pin may cause permanent damage to the device.
4. Continuous output current capability is dependent on sufficient package heatsinking to keep junction temperature 150 C.
5. ESD1 testing is performed in accordance with the Human Body Model (CZAP = 100 pF, RZAP = 1500 ), ESD2 testing is performed in
accordance with the Machine Model (CZAP = 200 pF, RZAP = 0 ), and the Charge Device Model (CDM), Robotic (CZAP = 4.0 pF).
6. The limiting factor is junction temperature, taking into account the power dissipation, thermal resistance, and heat sinking provided. Brief
non-repetitive excursions of junction temperature above 150 C can be tolerated provided the duration does not exceed 30 seconds
maximum. (Non-repetitive events are defined as not occurring more than once in 24 hours.)
33926
6
Analog Integrated Circuit Device Data
Freescale Semiconductor

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