MKP383515040JKM2T0 查看數據表（PDF） - Vishay Semiconductors
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MKP383515040JKM2T0
Vishay Semiconductors
MKP383515040JKM2T0 Datasheet PDF : 16 Pages
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www.vishay.com
MKP383
Vishay BCcomponents
HEAT CONDUCTIVITY (G) AS A FUNCTION OF (ORIGINAL) PITCH AND CAPACITOR BODY
THICKNESS IN mW/°C
Wmax. (mm)
3.0
4.0
4.5
5.0
6.0
7.0
8.5
9.0
10.0
11.0
13.0
15.0
18.0
18.5
21.0
21.5
24.0
30.0
PITCH 7.5 mm
4
5
5
6
-
-
-
-
-
-
-
-
-
-
-
-
-
-
PITCH 10 mm
-
6.5
-
7.5
9.0
-
-
-
-
-
-
-
-
-
-
-
-
-
HEAT CONDUCTIVITY (mW/°C)
PITCH 15 mm PITCH 22.5 mm
-
-
-
-
-
-
10
-
11
19
12
21
16
25
-
-
18
28
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
PITCH 27.5 mm
-
-
-
-
-
-
31
-
36
42
48
57
-
68
-
-
-
PITCH 37.5 mm
-
-
-
-
-
-
-
-
-
-
-
-
-
89
-
102
116
134
POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function
of the free air ambient temperature.
The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical information film
capacitors with the typical tgd of the curves.”.
The component temperature rise (T) can be measured (see section “Measuring the component temperature” for more details)
or calculated by T = P/G:
• T = component temperature rise (°C)
• P = power dissipation of the component (mW)
• G = heat conductivity of the component (mW/°C)
MEASURING THE COMPONENT TEMPERATURE
A thermocouple must be attached to the capacitor body as in:
Thermocouple
The temperature is measured in unloaded (Tamb) and maximum loaded condition (Tc).
The temperature rise is given by T = Tc - Tamb.
To avoid radiation or convection, the capacitor should be tested in a wind-free box.
Revision: 08-Aug-2018
10
Document Number: 28173
For technical questions, contact: dc-film@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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