WSLP4026 查看數據表（PDF） - Vishay Semiconductors
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产品描述 (功能)
生产厂家
WSLP4026
Vishay Semiconductors
WSLP4026 Datasheet PDF : 5 Pages
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www.vishay.com
WSLP4026
Vishay Dale
TECHNICAL SPECIFICATIONS
PARAMETER
UNIT
RESISTOR CHARACTERISTICS
Component temperature coefficient
(including terminal) (1)
TCR measured from -55 °C to 150 °C
Element TCR (2)
ppm/°C
ppm/°C
± 75 for 0.5 m to 5 m
± 110 for 0.3 m; ± 30 for 0.2 m
< 20
Operating temperature range
°C
Maximum working voltage (3)
V
-65 to +170
(P x R)1/2
Notes
(1) Component TCR - total TCR that includes the TCR effects of the resistor element and the copper terminal
(2) Element TCR - only applies to the alloy used for the resistor element
(3) Maximum working voltage - the WSL is not voltage sensitive, but is limited by power / energy dissipation and is also not ESD sensitive
DIMENSIONS in inches (millimeters)
W
L
T
U
S
R
N
H
c
b
w
b
d
a
Notes
• 3D models available: www.vishay.com/doc?30316
• Surface mount solder profile recommendations: www.vishay.com/doc?31052
MODEL
WSLP4026
L
W
H
0.400 ± 0.008 0.260 + 0.012/- 0.008 Please see
(10.1 ± 0.2)
(6.6 + 0.3/- 0.2) table below
DIMENSIONS
R
(REF.)
S
T
U
N
0.198 0.028 ± 0.004 0.016 ± 0.002 0.078 ± 0.004 0.039 ± 0.006
(5.0)
(0.7 ± 0.1) (0.4 ± 0.05) (2.0 ± 0.1) (0.99 ± 0.15)
MODEL
WSLP4026
a
0.220 (5.6)
b
0.096 (2.44)
SOLDER PAD DIMENSIONS
c
0.035 (0.89)
d
0.035 (0.89)
w
0.420 (10.6)
MODEL
RESISTANCE VALUE
(m)
THERMAL RESISTANCE (1)
(°C/W)
ELEMENT MATERIAL
HEIGHT
H
0.2
3
Mn-Cu-Sn
0.150 ± 0.008 (3.81 ± 0.2)
0.3
4
Mn-Cu
0.141 ± 0.008 (3.58 ± 0.2)
0.5
6
Mn-Cu
0.116 ± 0.008 (2.95 ± 0.2)
0.7
8
Mn-Cu
0.111 ± 0.008 (2.82 ± 0.2)
1.0
WSLP4026
1.3
10
Mn-Cu
0.1055 ± 0.008 (2.68 ± 0.2)
11
Ni-Cr
0.119 ± 0.008 (3.02 ± 0.2)
2.0
16
Ni-Cr
0.114 ± 0.008 (2.9 ± 0.2)
3.0
19
Ni-Cr
0.110 ± 0.008 (2.79 ± 0.2)
4.0
22
Ni-Cr
0.110 ± 0.008 (2.79 ± 0.2)
5.0
38
Ni-Cr
0.110 ± 0.008 (2.79 ± 0.2)
Note
(1) The full power rating of Power Metal Strip resistors are dependent upon the ability of the circuit board to dissipate the heat energy created
in the resistance element. It is recommended to follow common design practices for power semiconductors that ensure the junction
temperature is maintained with in thermal limits by using large pad surfaces, thermal vias, heavier copper weights, internal layers as well as
other thermal spreading features. The Thermal resistance values provided function in the same manner as junction to terminal temperature
Revision: 19-Oct-2018
2
Document Number: 30180
For technical questions, contact: ww2bresistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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