EN80960SA 查看數據表（PDF） - Intel

零件编号

产品描述 (功能)

生产厂家

EN80960SA

EMBEDDED 32-BIT MICROPROCESSOR WITH 16-BIT BURST DATA BUS

Intel 

80960SA

EMBEDDED 32-BIT MICROPROCESSOR

WITH 16-BIT BURST DATA BUS

CONTENTS

PAGE

1.0 THE i960® PROCESSOR ...........................................................................................................................1

1.1 Key Performance Features .................................................................................................................2

1.1.1 Memory Space And Addressing Modes ...................................................................................4

1.1.2 Data Types ...............................................................................................................................4

1.1.3 Large Register Set ...................................................................................................................4

1.1.4 Multiple Register Sets ..............................................................................................................5

1.1.5 Instruction Cache .....................................................................................................................6

1.1.6 Register Scoreboarding ...........................................................................................................6

1.1.7 High Bandwidth Bus ................................................................................................................6

1.1.8 Interrupt Handling ....................................................................................................................6

1.1.9 Debug Features .......................................................................................................................6

1.1.10 Fault Detection .......................................................................................................................7

1.1.11 Built-in Testability ....................................................................................................................7

1.1.12 CHMOS .................................................................................................................................. 7

2.0 ELECTRICAL SPECIFICATIONS............................................................................................................. 11

2.1 Power and Grounding ....................................................................................................................... 11

2.2 Power Decoupling Recommendations .............................................................................................. 11

2.3 Connection Recommendations ......................................................................................................... 11

2.4 Characteristic Curves ....................................................................................................................... 11

2.5 Test Load Circuit ............................................................................................................................... 13

2.6 ABSOLUTE MAXIMUM RATINGS* .................................................................................................. 14

2.7 DC Characteristics ............................................................................................................................ 14

2.8 AC Specifications .............................................................................................................................. 15

3.0 MECHANICAL DATA................................................................................................................................ 21

3.1 Packaging ......................................................................................................................................... 21

3.2 Pin Assignment ................................................................................................................................. 21

3.3 Pinout ................................................................................................................................................ 23

3.4 Package Thermal Specifications ...................................................................................................... 27

3.5 Stepping Register Information .......................................................................................................... 27

4.0 WAVEFORMS ........................................................................................................................................... 28

5.0 REVISION HISTORY ................................................................................................................................ 34

ii

Share Link: