EN80960SA 查看數據表（PDF） - Intel
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EN80960SA Datasheet PDF : 39 Pages
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80960SA
3.4 Package Thermal Specifications
The 80960SA is specified for operation when case
temperature is within the range 0°C to +85°C (PLCC)
or 0°C to 100°C (QFP). Measure case temperature
at the top center of the package. Ambient temper-
ature can be calculated from:
TJ = TC + P*θJC
TA = TJ - P*θJA
TC = TA + P*[θJA−θJC]
Compute P by multiplying the maximum voltage by
the typical current at maximum temperature. Values
for θJA and θJC for various airflows are given in Table
13 for the QFP package and in Table 14 for the
PLCC package. ICC at maximum temperature is
typically 80 percent of specified ICC maximum (cold).
Table 13. 80960SA QFP Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
50 100 200 400 600 800
θ Junction-to-Ambient (Case
59
57
54
50
44
40
38
measured in the middle of the
top of the package)
(No Heatsink)
θ Junction-to-Case
11
11
11
11
11
11
11
NOTES:
This table applies to 80960SA QFP soldered directly to board.
Table 14. 80960SA PLCC Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
50 100 200 400 600 800
θ Junction-to-Ambient
34
32 29.5 28
25
23
21
(No Heatsink)
θ Junction-to-Case
12
12
12
12
12
12
12
NOTES:
This table applies to 80960SA PLCC soldered directly to board.
1000
20.5
12
3.5 Stepping Register Information
Upon reset, register g0 contains die stepping infor-
mation. Table 15 shows the relationship between the
number in g0 and the current die stepping
Table 15. Die Stepping Cross Reference
Register g0
01010101H
Die Stepping
C-1
The current numbering pattern in g0 may not be
consistent with past or future steppings of this
product.
27
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