TDA2030H 查看數據表（PDF） - STMicroelectronics
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TDA2030H Datasheet PDF : 13 Pages
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TDA2030
PRACTICAL CONSIDERATIONS
Printed circuit board
The layout shown in Fig. 16 should be adopted by
the designers. If different layouts are used, the
ground points of input 1 and input 2 must be well
decoupled from the ground return of the output in
which a high current flows.
Assembly suggestion
No electrical isolation is needed between the
package and the heatsink with single supply voltage
configuration.
Application suggestions
The recommended values of the components are
those shown on application circuit of fig. 13.
Different values can be used. The following table
can help the designer.
Component
R1
R2
R3
R4
R5
C1
C2
C3, C4
C5, C6
C7
C8
D1, D2
Recomm.
value
Purpose
Larger than
recommended value
22 kΩ
Closed loop gain
setting
Increase of gain
680 Ω
Closed loop gain
setting
Decrease of gain (*)
22 kΩ
Non inverting input
biasing
Increase of input
impedance
1Ω
Frequency stability
Danger of osccilat. at
high frequencies
with induct. loads
≅ 3 R2
Upper frequency
cutoff
Poor high frequencies
attenuation
1 µF
Input DC
decoupling
22 µF
Inverting DC
decoupling
0.1 µF
Supply voltage
bypass
100 µF
Supply voltage
bypass
0.22 µF Frequency stability
≅
2π
1
B R1
Upper frequency
cutoff
Smaller bandwidth
1N4001 To protect the device against output voltage spikes
Smaller than
recommended value
Decrease of gain (*)
Increase of gain
Decrease of input
impedance
Danger of
oscillation
Increase of low
frequencies cutoff
Increase of low
frequencies cutoff
Danger of
oscillation
Danger of
oscillation
Danger of oscillation
Larger bandwidth
(*) Closed loop gain must be higher than 24dB
7/12
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