AD9204(RevA) 查看數據表（PDF） - Analog Devices
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AD9204
(Rev.:RevA)
(Rev.:RevA)
Analog Devices
AD9204 Datasheet PDF : 36 Pages
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Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 6.
Parameter
AVDD to AGND
DRVDD to AGND
VIN+A, VIN+B, VIN−A, VIN−B to AGND
CLK+, CLK− to AGND
SYNC to AGND
VREF to AGND
SENSE to AGND
VCM to AGND
RBIAS to AGND
CSB to AGND
SCLK/DFS to AGND
SDIO/DCS to AGND
OEB to AGND
PDWN to AGND
D0A/D0B Through D13A/D13B to AGND
DCOA/DCOB to AGND
Operating Temperature Range (Ambient)
Maximum Junction Temperature
Under Bias
Storage Temperature Range (Ambient)
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−40°C to +85°C
150°C
−65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
AD9204
THERMAL CHARACTERISTICS
The exposed paddle is the only ground connection for the chip.
The exposed paddle must be soldered to the AGND plane of the
user circuit board. Soldering the exposed paddle to the user
board also increases the reliability of the solder joints and
maximizes the thermal capability of the package.
Table 7. Thermal Resistance
Package Type
Airflow
Velocity
(m/sec)
64-Lead LFCSP 0
9 mm × 9 mm 1.0
(CP-64-4)
2.5
θJA1, 2
23
20
18
θJC1, 3
2.0
θJB1, 4
12
Unit
°C/W
°C/W
°C/W
1 Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board.
2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
3 Per MIL-Std 883, Method 1012.1.
4 Per JEDEC JESD51-8 (still air).
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Table 7, airflow improves heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes reduces the θJA.
ESD CAUTION
Rev. A | Page 9 of 36
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