ESDALC6-4N4 查看數據表（PDF） - STMicroelectronics

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产品描述 (功能)

生产厂家

ESDALC6-4N4

ESD array with low capacitance

STMicroelectronics 

Package information

3

Package information

ESDALC6-4N4

● Epoxy meets UL94, V0

● Lead-free package

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

Table 3. µQFN-4L dimensions

Dimensions

Ref.

Millimeters

Inches

E

L

D

D2

e

21

Index

area

E2

3 4 L1

b

A

A1

Min. Typ. Max. Min. Typ. Max.

A 0.31 0.38 0.40 0.012 0.015 0.016

A1 0.00 0.02 0.05 0.00 0.0008 0.002

b 0.10 0.15 0.20 0.004 0.006 0.008

D 0.70 0.80 0.90 0.028 0.031 0.035

D2 0.50 0.58 0.65 0.020 0.023 0.026

e 0.35 0.40 0.45 0.014 0.016 0.018

E 0.90 1.00 1.10 0.035 0.039 0.043

E2 0.15 0.20 0.25 0.006 0.008 0.010

L 0.18 0.23 0.28 0.007 0.009 0.011

L1 0.00 -- 0.05 0.00 -- 0.002

Figure 14. Footprint dimensions (in mm) Figure 15. Marking

0.4

Note:

0.17

1.4

0.58

0.43

0.2

0.18

0.58

Product marking may be rotated by multiples of 90° for assembly plant differentiation. In no

case should this product marking be used to orient the component for its placement on a

PCB. Only pin 1 mark is to be used for this purpose.

6/11

Doc ID 022191 Rev 2

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