ATN3590 查看數據表（PDF） - Unspecified

零件编号

产品描述 (功能)

生产厂家

ATN3590

Fixed Attenuators

Unspecified 

DATA SHEET • ATN3590 SERIES FIXED ATTENUATORS

The metallization on the circuit medium to which the attenuator is

to be mounted must also include the split in the ground

connections. It is recommended that the gap between the ground

pads on the circuit medium should be 250 μm wide by 900 μm

long.

The input and output signal paths should be connected to the

signal path bond pads on the attenuator with Au ribbons or wires.

It is recommended that these connections be made with

0.25 x 3 mil (6.25 x 75 microns) ribbons, as shown in Figure 12.

Package Dimensions

The PCB layout footprint for the ATN3590 attenuators is shown in

Figure 13. Package dimensions are provided in Figure 14.

Packaging

The standard mode of packaging for shipment of the ATN3590

Attenuator Series is 100 pieces per GelPak™.

Ground

0.25 x 3 mil Au Ribbon

(2 Places)

Input/Output

Output/Input

Ground

Figure 12. Suggested Die Mount and Ribbon Attachment

For best performance, no PCB topside

ground metal should remain in this area

(250 x 900 microns, centered on die)

Figure 13. PCB Layout Footprint

Ground metal (2 places)

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

200842B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • December 2, 2009

5

Share Link: