ACT4503YH-T 查看數據表（PDF） - Unspecified
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ACT4503YH-T Datasheet PDF : 55 Pages
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ACT2801 5V/1A Smart Power Bank
Bill of Materials
REF
L1
Q1
D1
D2
C2, C5
C3
C4
C6
C7
C8
C11,C12,C14
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R11
R12,R13
R14
R15
LED1,LED2,LED3,LED4
USB
PB
Micro-USB
U1
Description
SWPA4020S1R0NT 2.2uH 3.4A (4*4*2mm)
SSC8013, Rdson=38mΩ at VGS = - 4.5 V
SS12,Vf=0.5V, 20V Schottky
1N4148, Vf=0.7V, 75V Schottky
Ceramic capacitor, 22uF/10V, X7R, 1206
Ceramic capacitor, 4.7uF/10V, X7R, 0805
Ceramic capacitor, 0.1uF/10V, X7R, 0603
Ceramic capacitor, 10nF/10V, X7R, 0402
Ceramic capacitor, 1nF/10V, X7R, 0603
Ceramic capacitor, 1uF/10V, X7R, 0603
Ceramic capacitor, 2.2uF/10V, X7R, 0603
Chip Resistor, 1.5kΩ, 1/16W, 1%, 0402
Chip Resistor, 50mΩ, 1/8W, 1%, 1206
Chip Resistor,100kΩ, 1/16W, 1%, 0402
Chip Resistor, 39kΩ, 1/16W, 1%, 0402
Chip Resistor, 25kΩ, 1/16W, 1%, 0402
Chip Resistor, 10kΩ, 1/16W, 1%, 0402
Chip Resistor, 60kΩ, 1/16W, 1%, 0402
Chip Resistor, 50kΩ, 1/16W, 1%, 0402
Chip Resistor, 1Ω, 1/10W, 5%, 0805
Chip Resistor, 2.7Ω, 1/8W, 5%, 1206
Chip Resistor, 200kΩ, 1/16W, 5%, 0603
Chip Resistor, 715kΩ, 1/16W, 5%, 0603
Chip Resistor, 100kΩ, 1/16W, 5%, 0603
Chip Resistor, 2.2Ω, 1/16W, 5%, 0603
LED, 0603, Blue
10.2*14.6*7mm, 4P
Push Button
MICRO USB 5P/F SMT B
IC, ACT2801 T-QFN 44-24
PCB Top Layer
MFTR
Sunlord
SPIRIT
Mccsemi
Philips
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
Murata/TDK
LED Manu
ACT
2) Use copper plane for PGND for best heat dissipation and
noise immunity. AGND and PGND are connected under the IC
thermal pad with 4x4 vias matrix.
3) SW copper area should be limited due to EMI considera-
tion.
4) Use Kevin sense from sense resistor R2 to CSP and CSN pins
as shown in the layout figure.
5) A separate trace is from VBAT input to BAT pin for battery
voltage sense accuracy.
6) RC snubber is recommended to add across SW to PGND to
reduce EMI noise.
7) A 10V/1A schottky is added from inductor terminal to VOUT
to reduce EMI noise.
Typical performance characteristics
Radiated EMI Test
PCB Bottom Layer
PC Board Layout Guidance
1) Arrange the power components to reduce the AC loop size
that consists of C2, VOUT, SW and PGND. C2 (1206 size) must
be placed close to the IC and across the VOUT and PGND
traces and SW trace goes under the C2 .
EVALUATION
KITS
Power Bank ACT2801-
DMB-#1
VBAT
3.0V-4.5V
Vo
5V+/-100mV
Io
1000mA
6
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