ACT4503YH-T 查看數據表（PDF） - Unspecified

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ACT4503YH-T

High Power DC-DC Converter Products

Unspecified 

ACT2802 5V/2.1A Smart Power Bank

Bill of Materials

REF

L1

U2

Q3

D1

D2

C2,C5,C9

C3

C4

C6

C7

C8,C11,C12, C16

R1

R2,R2A

R3

R4,R15

R5

R6

R7

R8

R9

Description

MFTR

2.2uH 6*3*3 coil Φ0.55mm 6A

Sunlord

AO4453,Rdson=19mΩ at GS=-4.5V

AOS

MMBT3906

Vishay

SS12,Vf=0.5V, 20V Schottky

Mccsemi

IN4148, Vf=0.7V, 75V Fast Swith Diode Philips

Ceramic capacitor, 22uF/10V, X7R, 1206 Murata/TDK

Ceramic capacitor, 4.7uF/10V, X7R, 0805 Murata/TDK

Ceramic capacitor, 0.1uF/10V, X7R, 0603 Murata/TDK

Ceramic capacitor, 10nF/10V, X7R, 0603 Murata/TDK

Ceramic capacitor, 2.2nF/10V, X7R, 0603 Murata/TDK

Ceramic capacitor, 2.2uF/10V, X7R, 0603 Murata/TDK

Chip Resistor, 750Ω, 1/16W, 1%, 0603 Murata/TDK

Chip Resistor, 50mΩ, 1/8W, 1%, 1206 Murata/TDK

Chip Resistor, 93.1kΩ, 1/16W, 1%, 0603 Murata/TDK

Chip Resistor, 43.2kΩ, 1/16W, 1%, 0603 Murata/TDK

Chip Resistor, 25kΩ, 1/16W, 1%, 0603 Murata/TDK

Chip Resistor, 10kΩ, 1/16W, 5%, 0603 Murata/TDK

Chip Resistor, 60kΩ, 1/16W, 1%, 0603 Murata/TDK

Chip Resistor, 100kΩ, 1/16W, 1%, 0603 Murata/TDK

Chip Resistor, 1Ω, 1/10W, 5%, 0805 Murata/TDK

R10

R11

R12,R13

R14,R16

R17

R18,R20

R21

LED1,LED2,LED3,LED4

PB

Chip Resistor, 2.7Ω, 1/8W, 5%, 1206 Murata/TDK

Chip Resistor, 200kΩ, 1/16W, 5%, 0603 Murata/TDK

Chip Resistor, 715kΩ, 1/16W, 5%, 0603 Murata/TDK

Chip Resistor, 49.9kΩ, 1/16W, 1%, 0603 Murata/TDK

Chip Resistor, 75kΩ, 1/16W, 1%, 0603 Murata/TDK

Chip Resistor, 100kΩ, 1/16W, 5%, 0603 Murata/TDK

Chip Resistor, 2.2Ω, 1/16W, 5%, 0603 Murata/TDK

LED, 0603, Blue

Push Button

USB

Micro-USB

U1

10.2*14.6*7mm, 4P，DIP，90°

MICRO USB 5P/F SMT B

IC, ACT2802 T-QFN 44-24

ACT

PCB Top Layer

2) Use copper plane for PGND for best heat dissipation and

noise immunity. AGND and PGND are connected under the IC

thermal pad with 4x4 vias matrix.

3) SW copper area should be limited due to EMI considera-

tion.

4) Use Kevin sense from sense resistor R2A and R2B to CSP

and CSN pins as shown in the layout figure.

5) A separate trace is from VBAT input to BAT pin for battery

voltage sense accuracy.

6) RC snubber is recommended to add across SW to PGND to

reduce EMI noise.

7) A 20V/3.0A schottky is added from inductor terminal to

VOUT to reduce EMI noise.

Typical performance characteristics

Radiated EMI Test

PCB Bottom Layer

PC Board Layout Guidance

1) Arrange the power components to reduce the AC loop size

that consists of C2, VOUT, SW and PGND. C2 (1206 size) must

be placed close to the IC and across the VOUT and PGND

traces and SW trace goes under the C2 .

EVALUATION

KITS

Power Bank ACT2802-

DMB-#1

VBAT

3.0V-4.5V

Vo

5V+/-100mV

Io

2100mA

8

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