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HA-5002-9 查看數據表(PDF) - Intersil

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HA-5002-9 Datasheet PDF : 14 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
Test Circuit and Waveforms (Continued)
HA-5002
VIN
VIN
VOUT
VOUT
RS = 50, RL = 100
LARGE SIGNAL WAVEFORMS
RS = 50, RL = 1k
LARGE SIGNAL WAVEFORMS
Schematic Diagram
V1+
R9
Q25
R10
Q9
Q10
R5
Q21
Q11
Q15
Q23
R7
R8
Q26 Q20
Q27
Q19
Q18
R4
Q3
RN1
R1
V2+
Q12
Q1
Q6
R11
Q7 Q4
IN
OUT
RN2
Q5
Q22
Q2
Q8
Q24
Q17 R6
Q16
Q14
V2-
Q13
R12 R3
R2
RN3
Application Information
Layout Considerations
The wide bandwidth of the HA-5002 necessitates that high
frequency circuit layout procedures be followed. Failure to
follow these guidelines can result in marginal performance.
Probably the most crucial of the RF/video layout rules is the
use of a ground plane. A ground plane provides isolation and
minimizes distributed circuit capacitance and inductance
which will degrade high frequency performance.
V1-
Other considerations are proper power supply bypassing
and keeping the input and output connections as short as
possible which minimizes distributed capacitance and
reduces board space.
Power Supply Decoupling
For optimal device performance, it is recommended that the
positive and negative power supplies be bypassed with
capacitors to ground. Ceramic capacitors ranging in value
from 0.01 to 0.1µF will minimize high frequency variations in
supply voltage, while low frequency bypassing requires
5
FN2921.11
March 8, 2006

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