C1206F104K1RACTU 查看數據表（PDF） - Unspecified

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C1206F104K1RACTU

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

Open Mode Design (FO-CAP), X7R Dielectric, 16 – 200 VDC (Commercial & Automotive Grade)

Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination

EIA

Size

Code

0805

1206

1210

1812

Metric

Size

Code

2012

3216

3225

4532

Density Level A:

Maximum (Most)

Land Protrusion (mm)

C

Y

X V1 V2

0.99 1.44 1.66 4.47 2.71

1.59 1.62 2.06 5.85 3.06

1.59 1.62 3.01 5.90 4.01

2.10 1.80 3.60 7.00 4.60

Density Level B:

Median (Nominal)

Land Protrusion (mm)

C

Y

X V1 V2

0.89 1.24 1.56 3.57 2.11

1.49 1.42 1.96 4.95 2.46

1.49 1.42 2.91 4.95 3.41

2.00 1.60 3.50 6.10 4.00

Density Level C:

Minimum (Least)

Land Protrusion (mm)

C

Y

X V1 V2

0.79 1.04 1.46 2.42 1.81

1.39 1.22 1.86 4.25 2.16

1.39 1.22 2.81 4.25 3.11

1.90 1.40 3.40 5.40 3.70

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

V1

Y

Y

X

X

V2

C

C

Grid Placement Courtyard

© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1012_X7R_OPENMODE_SMD • 10/14/2016 11

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