NCP565(2004) 查看數據表（PDF） - ON Semiconductor
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NCP565 Datasheet PDF : 12 Pages
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NCP565
PACKAGE DIMENSIONS
D2PAK−5
D2T SUFFIX
CASE 936A−02
ISSUE B
−T−
A
OPTIONAL
CHAMFER
E
TERMINAL 6
U
K
S
B
H
1 2345
D
0.010 (0.254) M T
G
V
ML
N
P
R
C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS A
AND K.
4. DIMENSIONS U AND V ESTABLISH A MINIMUM
MOUNTING SURFACE FOR TERMINAL 6.
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH OR GATE PROTRUSIONS. MOLD FLASH
AND GATE PROTRUSIONS NOT TO EXCEED 0.025
(0.635) MAXIMUM.
INCHES
MILLIMETERS
DIM MIN MAX MIN MAX
A 0.386 0.403 9.804 10.236
B 0.356 0.368 9.042 9.347
C 0.170 0.180 4.318 4.572
D 0.026 0.036 0.660 0.914
E 0.045 0.055 1.143 1.397
G 0.067 BSC
1.702 BSC
H 0.539 0.579 13.691 14.707
K 0.050 REF
1.270 REF
L 0.000 0.010 0.000 0.254
M 0.088 0.102 2.235 2.591
N 0.018 0.026 0.457 0.660
P 0.058 0.078 1.473 1.981
R
5 _REF
5_ REF
S 0.116 REF
2.946 REF
U
0.200 MIN
5.080 MIN
V
0.250 MIN
6.350 MIN
SOLDERING FOOTPRINT*
8.38
0.33
10.66
0.42
1.702
0.067
16.02
0.63
1.016
3.05
0.04
0.12
ǒ Ǔ SCALE 3:1
mm
inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
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