ATSAM3S(2009) 查看數據表（PDF） - Atmel Corporation

零件编号

产品描述 (功能)

生产厂家

ATSAM3S
(Rev.:2009)

AT91 ARM Cortex M3-based Processor

Atmel Corporation 

4. Package and Pinout

4.1 SAM3S4/2/1C Package and Pinout

Figure 4-2 shows the orientation of the 100-ball LFBGA Package

The 100-ball LFBGA pinout will be specified as soon as the first layout of the device is

completed.

4.1.1 100-lead LQFP Package Outline

Figure 4-1. Orientation of the 100-lead LQFP Package

75

51

76

50

4.1.2

100

1

26

25

100-ball LFBGA Package Outline

The 100-Ball LFBGA package has a 0.8 mm ball pitch and respects Green Standards. Its dimen-

sions are 9 x 9 x 1.1 mm.

Figure 4-2.

Orientation of the 100-BALL LFBGA Package

TOP VIEW

10

9

8

7

6

5

4

3

2

1

ABCDE FGH J K

BALL A1

10 SAM3S Summary

6500AS–ATARM–11-Dec-09

Share Link: