SML-211WT 查看數據表（PDF） - ROHM Semiconductor

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SML-211WT

SML-21 Series

ROHM Semiconductor 

SML-21 Series

Data Sheet

4-4. Mechanical Stress after Mounting

The mechanical stress may damage the LED after Circuit Mounting, so please pay attention to the touch on

product.

Stress strength according to

the mounting position:

A>B>C>D

4-5. Soldering Pattern for Recommendation

We recommend the soldering pattern that shows on the right. It will be

different according to mounting situation of circuit board, therefore, please

concern before designing.

*The product has adopted the electrode structure that it should solder with

back electrode of the product.

4-6. Reflow Profile

For reflow profile, please refer to the conditions below:(*)

• Meaning of marks, Conditions

Mark

Meanings

Conditions

Tsmax

Tsmin

Ts

TL

tL

TP

tP

ΔTR/Δt

ΔTD/Δt

Maximum of pre-heating temperature

180ºC

Minimum of pre-heating temperature

140ºC

Time from Tsmin to Tsmax

Reference temperature

Over 60sec.

230 to 260ºC

Retention time for TL

Peak temperature

Within 40sec.

260ºC(Max)

Time for peak temperature

Within 10sec.

Temperature rising rate

Under 3ºC/sec.

Temperature decreasing rate Over -3ºC/sec.

(Fig-1)

*Above conditions are for reference. Therefore, evaluate by customer’s own circuit boards and reflow furnaces

before using, because stress from circuit boards and temperature variations of reflow furnaces vary by

customer’s own conditions.

4-7. Cleaning after Soldering

Please follow the conditions below if the cleaning is necessary after soldering.

Solvent

Temperature

Ultrasonic Cleaning

Drying

We recommend to use alcohols solvent such as, isopropyl alcohols

Under 30ºC within 3 minutes

15W / Below 1 liter (capacity of tank)

Under 100ºC within 3 minutes

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2014.11 - Rev.D

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