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NTMFS4833NT3G 查看數據表(PDF) - ON Semiconductor

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NTMFS4833NT3G Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
NTMFS4833N
MOSFET – Power, Single,
N-Channel, SO-8FL
30 V, 191 A
Features
Low RDS(on) to Minimize Conduction Losses
Low Capacitance to Minimize Driver Losses
Optimized Gate Charge to Minimize Switching Losses
These are PbFree Devices
Applications
Refer to Application Note AND8195/D
CPU Power Delivery
DCDC Converters
Low Side Switching
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
DraintoSource Voltage
VDSS
30
V
GatetoSource Voltage
VGS
±20
V
Continuous Drain
Current RqJA
(Note 1)
TA = 25°C
ID
TA = 85°C
28
A
20.5
Power Dissipation
RqJA (Note 1)
TA = 25°C
PD
2.7
W
Continuous Drain
TA = 25°C
ID
Current RqJA
(Note 2)
Steady TA = 85°C
State
Power Dissipation
TA = 25°C
PD
RqJA (Note 2)
16
A
12
1.1
W
Continuous Drain
Current RqJC
(Note 1)
TC = 25°C
ID
TC = 85°C
191
A
138
Power Dissipation
RqJC (Note 1)
TC = 25°C
PD
113.6 W
Pulsed Drain
Current
TA = 25°C,
tp = 10 ms
IDM
288
A
Operating Junction and Storage
Temperature
TJ, TSTG 55 to °C
+150
Source Current (Body Diode)
Drain to Source dV/dt
IS
dV/dt
104
A
6
V/ns
Single Pulse DraintoSource Avalanche
Energy (TJ = 25°C, VDD = 30 V, VGS = 10 V,
IL = 35 Apk, L = 1.0 mH, RG = 25 W)
EAS
612.5 mJ
Lead Temperature for Soldering Purposes
(1/8from case for 10 s)
TL
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. Surfacemounted on FR4 board using 1 sqin pad, 1 oz Cu.
http://onsemi.com
V(BR)DSS
30 V
RDS(ON) MAX
2.0 mW @ 10 V
3.0 mW @ 4.5 V
D (5)
ID MAX
191 A
G (4)
S (1,2,3)
NCHANNEL MOSFET
1
SO8 FLAT LEAD
CASE 488AA
STYLE 1
MARKING
DIAGRAM
D
S
D
S 4833N
S AYWZZ
G
D
D
A
= Assembly Location
Y
= Year
W
= Work Week
ZZ
= Lot Traceability
ORDERING INFORMATION
Device
Package
Shipping
NTMFS4833NT1G SO8FL 1500/Tape & Reel
(PbFree)
NTMFS4833NT3G SO8FL 5000/Tape & Reel
(PbFree)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
May, 2019 Rev. 10
Publication Order Number:
NTMFS4833N/D

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