AXK720147G(2013) 查看數據表（PDF） - Panasonic Corporation

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AXK720147G
(Rev.:2013)

For board-to-board For board-to-FPC Narrow pitch connectors (0.4mm pitch)

Panasonic Corporation 

AXK7, 8

NOTES

1. As shown below, excess force

during insertion may result in damage

to the connector or removal of the

solder. Also, to prevent connector

damage please confirm the correct

position before mating connectors.

1) Without soldering terminals

Socket

Recommended PC board pattern (TOP VIEW)

0.40±0.05

0.40±0.05

0.23±0.03

Header

Recommended PC board pattern (TOP VIEW)

0.40±0.05

0.23±0.03

0.40±0.05

2. Keep the PC board warp no more

than 0.03 mm in relation to the overall

length of the connector.

Max. 0.03 mm

Max. 0.03 mm

3. Recommended PC board and metal

mask patterns

Connectors are mounted with high pitch

density, intervals of 0.35 mm, 0.4 mm or

0.5 mm.

In order to reduce solder and flux rise,

solder bridges and other issues make

sure the proper levels of solder is used.

The figures to the right are recommended

metal mask patterns. Please use them as

a reference.

0.115±0.05

0.40±0.05

Recommended metal mask pattern

Metal mask thickness: When 150 µm

(Opening area ratio: 40%)

0.40±0.01

0.20±0.01

0.35±0.01

0.10±0.01

Recommended metal mask pattern

Metal mask thickness: When 120 µm

(Opening area ratio: 50%)

0.40±0.01

0.20±0.01

0.35±0.01

0.10±0.01

0.115±0.05

0.40±0.05

Recommended metal mask pattern

Metal mask thickness: When 150 µm

(Opening area ratio: 32%)

0.40±0.01

0.20±0.01

0.35±0.01

0.10±0.01

Recommended metal mask pattern

Metal mask thickness: When 120 µm

(Opening area ratio: 40%)

0.40±0.01

0.20±0.01

0.35±0.01

0.10±0.01

Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/

ACCTB57E 201303-T

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