HSMS-2817-BLKG 查看數據表（PDF） - Avago Technologies

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HSMS-2817-BLKG

Surface Mount RF Schottky Barrier Diodes

Avago Technologies 

SMT Assembly

Reliable assembly of surface mount components is a com‑

plex process that involves many material, process, and

equipment factors, including: method of heating (e.g., IR

or vapor phase reflow, wave soldering, etc.) circuit board

material, conductor thickness and pattern, type of solder

alloy, and the thermal conductivity and thermal mass of

components. Components with a low mass, such as the

SOT package, will reach solder reflow temperatures faster

than those with a greater mass.

Avago’s SOT diodes have been qualified to the time-tem‑

perature profile shown in Figure 8. This profile is repre‑

sentative of an IR reflow type of surface mount assembly

process.

After ramping up from room temperature, the circuit

board with components attached to it (held in place with

solder paste) passes through one or more preheat zones.

The preheat zones increase the temperature of the board

and components to prevent thermal shock and begin

evaporating solvents from the solder paste. The reflow

zone briefly elevates the temperature sufficiently to pro‑

duce a reflow of the solder.

The rates of change of temperature for the ramp-up and

cool-down zones are chosen to be low enough to not

cause deformation of the board or damage to compo‑

nents due to thermal shock. The maximum temperature

in the reflow zone (TMAX) should not exceed 260°C.

These parameters are typical for a surface mount assem‑

bly process for Avago diodes. As a general guideline, the

circuit board and components should be exposed only

to the minimum temperatures and times necessary to

achieve a uniform reflow of solder.

Tp

TL

Ts max

Ramp-up

tp

tL

Critical Zone

T L to Tp

Ts min

ts

Preheat

Ramp-down

25

t 25° C to Peak

Figure 8. Surface Mount Assembly Profile.

Time

Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)

Reflow Parameter

Average ramp-up rate (Liquidus Temperature (TS(max) to Peak)

Preheat

Temperature Min (TS(min))

Temperature Max (TS(max))

Time (min to max) (tS)

Ts(max) to TL Ramp-up Rate

Time maintained above:

Peak Temperature (TP)

Time within 5 °C of actual Peak temperature (tP)

Ramp-down Rate

Temperature (TL)

Time (tL)

Time 25 °C to Peak Temperature

Note 1: All temperatures refer to topside of the package, measured on the package body surface



Lead-Free Assembly

3°C/ second max

150°C

200°C

60-180 seconds

3°C/second max

217°C

60-150 seconds

260 +0/-5°C

20-40 seconds

6°C/second max

8 minutes max

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