B32913A4394M 查看數據表（PDF） - TDK Corporation

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B32913A4394M

Film Capacitors EMI Suppression Capacitors (MKP)

TDK Corporation 

B32911*3 ... B32916*3

X1 / 330 V AC

1.2 Resistance to soldering heat

Resistance to soldering heat is tested to IEC 60068-2-20, test Tb, method 1.

Conditions:

Series

Solder bath temperature Soldering time

MKT boxed (except 2.5 × 6.5 × 7.2 mm) 260 ±5 °C

10 ±1 s

coated

uncoated (lead spacing >10 mm)

MFP

MKP (lead spacing >7.5 mm)

MKT boxed (case 2.5 × 6.5 × 7.2 mm)

5 ±1 s

MKP (lead spacing ≤7.5 mm)

MKT uncoated (lead spacing ≤10 mm)

<4 s

recommended soldering

insulated (B32559)

profile for MKT uncoated

(lead spacing ≤ 10 mm) and

insulated (B32559)

Immersion depth

Shield

Evaluation criteria:

Visual inspection

ΔC/C0

tan δ

Please read Cautions and warnings and

Important notes at the end of this document.

2.0 +0/0.5 mm from capacitor body or seating plane

Heat-absorbing board, (1.5 ±0.5) mm thick, between

capacitor body and liquid solder

No visible damage

2% for MKT/MKP/MFP

5% for EMI suppression capacitors

As specified in sectional specification

Page 10 of 21

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