External view
SUCW3
1.SMD(type B)
+Vin
RC
-Vin
Pin terminal part details
1.8 ±0.3
[0.07]
Coplanarity within 0.1
[0.004]
2.DIP(type C)
+Vin
RC
-Vin
3.68±0.25
[0.14]
7
[0.28]
Adsorption area
Model
+Vout
COM
TRM
-Vout
Component area
Recommended Pad and Hole dia.
(TOP VIEW)
type B
25
[0.98]
1
[0.04] 1.27
[0.05]
26.16 ±0.6
[1.03]
Model
25
[0.98]
Part A
0.1min
[0.004]
Closeup of part A
3.2
[0.13]
type C
2
[0.08]
27.76
[1.09]
3.2
[0.13]
SU.SUC/SUT
º1.6
7-º0.9 [0.06]
[0.04]
Unit : 0.1inch
Dimensions in mm, [ ]=inches
+Vout
COM
TRM
Component area
-Vout
0.1min Part A
[0.004]
Closeup of part A
¶ Tolerance ±0.5 [±0.02]
¶ Dimensions in mm, [ ]=inches
¶ Pin terminal thickness : 0.3±0.1 [0.012]
¶ Pin terminal material : Copper alloy
¶ Plating treatment of terminal : Lead free plating
¶ Case thickness : 0.2±0.05 [0.008]
¶ Case material : Brass
¶ Plating treatment of case : Nickel plating
¶ Please keep enough creepage
distance with the pattern on PCB
and other components.
¶ Weight : 5g max
SU.SUC/SUT
1
[0.04] 1.27
[0.05]
22.86
[0.9]
SSUU.S.SUUCC//SSUUTT--2299