External view
1.SMD(type B)
+Vin
RC
-Vin
Pin terminal part details
1.8±0.3
[0.07]
2.DIP(type C)
+Vin
3.68±0.25
[0.14]
7
[0.28]
RC
-Vin
SUCW10
Adsorption area
Model
Compornent area
+Vout
COM
Recommended Pad and Hole dia.
(TOP VIEW)
type B
40.2
[1.58]
TRM
-Vout
Part A 0.1min
[0.004]
Closeup of part A
3.2
[0.13]
type C
2
[0.08]
43
[1.69]
3.2
[0.13]
SU.SUC/SUT
1
[0.04]
1.27
[0.05]
41.4 ±0.6
[1.63]
Model
40.2
[1.58]
Coplanarity within 0.1
[0.004]
Compornent area
+Vout
COM
TRM
-Vout
0.1min
[0.004] Part A
Closeup of part A
7-f0.9
[0.04]
f1.6
[0.06]
Unit : 0.1inch
Dimensions in mm, [ ]=inches
¶ Tolerance ±0.5 [±0.02]
¶ Dimensions in mm, [ ]=inches
¶ Pin terminal thickness : 0.3±0.1 [0.012]
¶ Pin terminal material : Copper alloy
¶ Plating treatment of terminal : Lead free plating
¶ Case thickness : 0.2±0.05 [0.008]
¶ Case material : Brass
¶ Plating treatment of case : Nickel plating
¶ Please keep enough creepage
distance with the pattern on PCB
and other components.
SU.SUC/SUT
¶ Weight : 10g max
1
[0.04]
1.27
[0.05]
38.1
[1.5]
SSUU.S.SUUCC//SSUUTT--3333