BT136S-600E 查看數據表（PDF） - NXP Semiconductors.

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BT136S-600E

4Q Triac

NXP Semiconductors. 

NXP Semiconductors

BT136S-600E

4Q Triac

8. Thermal characteristics

Table 5.

Symbol

Rth(j-mb)

Rth(j-a)

Thermal characteristics

Parameter

thermal resistance

from junction to

mounting base

thermal resistance

from junction to

ambient

Conditions

half cycle; Fig. 6

full cycle; Fig. 6

in free air; printed circuit board (FR4)

mounted; standard footprint, single-

sided copper, tin-plated

10

Zth(j-mb)

(K/W)

1

unidirectional

bidirectional

Min Typ Max Unit

-

-

3.7 K/W

-

-

3

K/W

-

75

-

K/W

003aae836

10- 1

P

10- 2

10- 5

10- 4

10- 3

10- 2

10- 1

tp

t

1

10

tp (s)

Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse width

BT136S-600E

Product data sheet

All information provided in this document is subject to legal disclaimers.

30 September 2013

© NXP N.V. 2013. All rights reserved

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