VSC6110 查看數據表（PDF） - Vitesse Semiconductor
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VSC6110 Datasheet PDF : 10 Pages
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VITESSE
SEMICONDUCTOR CORPORATION
Low Jitter
Clock Multiplier and Distributor
Advance Product Information
VSC6108/10/12
Package Thermal Characteristics
The VSC6108/10/12 is packaged into a thermally-enhanced plastic quad flatpack (PQFP). This package
adheres to the industry-standard EIAJ footprint for a 10x10mm body but has been enhanced to improve thermal
dissipation with the inclusion of an exposed Copper Heat Spreader. The package construction is as shown in
Figure 1.
Figure 1: Package Cross Section
Copper Heat Spreader
Insulator
Lead
Wire Bond
Die
Plastic Molding Compound
The thermal resistance is improved through low thermal resistance paths from the die to the exposed sur-
face of the heat spreader and from the die to the lead frame through the heat spreader overlap of the lead frame.
Table 8: 64-Pin PQFP Thermal Resistance
Symbol
θjc
θca
θca-100
θca-200
θca-400
θca-600
Description
Thermal resistance from junction to case
Thermal resistance from case to ambient in still air including conduction through
the leads for a non-thermally saturated board.
Thermal resistance from case to ambient in 100 LPFM air
Thermal resistance from case to ambient in 200 LPFM air
Thermal resistance from case to ambient in 400 LPFM air
Thermal resistance from case to ambient in 600 LPFM air
Value
2.5
37
31
28
24
22
Units
oC/W
oC/W
oC/W
oC/W
oC/W
oC/W
The VSC6108/10/12 is designed to operate at a maximum case temperature of up to 70 oC. The user must
guarantee that the maximum case temperature specification is not violated, most applications will require a
heatsink.
Page 8
© VITESSE SEMICONDUCTOR CORPORATION
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: 805/987-5896
G52224-0, Rev 2.1
2/15/99
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