MT6589 查看數據表（PDF） - MediaTek Inc

零件编号

产品描述 (功能)

生产厂家

MT6589

HSPA+ Smartphone Application Processor

MediaTek Inc 

MT6589

HSPA+ Smartphone Application Processor

Technical Brief

Confidential A

Table of Contents

Document Revision History .................................................................................................................. 2

Table of Contents ................................................................................................................................... 3

1 System Overview.......................................................................................................................... 6

1.1 Platform Features ................................................................................................................. 7

1.2 MODEM Features................................................................................................................. 8

1.3 Multimedia Features ............................................................................................................. 9

1.4 General Descriptions .......................................................................................................... 10

2 Product Description ................................................................................................................... 12

2.1 Pin Description.................................................................................................................... 12

2.1.1 Ball Map View..................................................................................................... 12

2.1.2 Pin Coordinate.................................................................................................... 13

2.1.3 Detailed Pin Description ..................................................................................... 17

2.2 Electrical Characteristic ...................................................................................................... 29

2.2.1 Absolute Maximum Ratings ............................................................................... 29

2.2.2 Recommended Operating Conditions ................................................................ 30

2.2.3 Storage Condition............................................................................................... 31

2.2.4 AC Electrical Characteristics and Timing Diagram ............................................ 31

2.3 System Configuration ......................................................................................................... 34

2.3.1 Mode Selection................................................................................................... 34

2.3.1 Constant Tie Pins ............................................................................................... 34

2.4 Power-on Sequence ........................................................................................................... 35

2.5 Analog Baseband ............................................................................................................... 36

2.5.1 BBRX.................................................................................................................. 37

2.5.2 BBTX .................................................................................................................. 39

2.5.3 2GBBTX ............................................................................................................. 41

2.5.4 APC-DAC ........................................................................................................... 42

2.5.5 VBIAS-DAC ........................................................................................................ 43

2.5.6 AUXADC ............................................................................................................ 44

2.5.7 Clock Squarer..................................................................................................... 46

2.5.8 Phase Locked Loop............................................................................................ 46

2.5.9 Temperature Sensor .......................................................................................... 51

2.6 Package Information........................................................................................................... 52

2.6.1 Package Outlines ............................................................................................... 52

2.6.2 Thermal Operating Specifications ...................................................................... 52

2.6.3 Lead-free Packaging .......................................................................................... 52

2.7 Ordering Information........................................................................................................... 53

2.7.1 Top Marking Definition ....................................................................................... 53

MediaTek Confidential

© 2012 MediaTek Inc.

This document contains information that is proprietary to MediaTek Inc.

Unauthorized reproduction or disclosure of this information in whole or in part is strictly prohibited.

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