ALT6725 查看數據表（PDF） - Anachip Corporation

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ALT6725

HELP3E Dual-band Cellular & PCS LTE 3.4 V Linear Power Amplifier Module

Anachip Corporation 

ALT6725

PCB BOARD Design GuidELINES

Refer to Figure 7 for the recommended PCB metal

design, soldermask design, and stencil print patterns

when assembling with ANADIGICS modules [5].

It is important to note that the PCB metal design is

dependent upon several factors: the electrical and

thermal performance requirements of the product,

and the PCB-to-device interconnect pattern. The

PCB metal design recommendations primarily deal

with te PCB-to-device interconnection. Specific

board-level electrical and thermal performance re-

quirements will be dictated by the physical geometry

of the specific application and are the responsibility

of the end product manufacturer.

Figure 7: PCB Board Design Guidelines

11

PRELIMINARY DATA SHEET - Rev 1.0

07/2012

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