MCP6401 查看數據表（PDF） - Microchip Technology

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MCP6401

1 MHz, 45 µA Op Amps

Microchip Technology 

MCP6401/1R/1U/2/4/6/7/9

E Temp Package Types

MCP6401

SC70-5, SOT-23-5

VOUT 1

VSS 2

VIN+ 3

5 VDD

4 VIN–

MCP6401R

SOT-23-5

VOUT 1

VDD 2

VIN+ 3

5 VSS

4 VIN–

MCP6402

MCP6401U

SOIC

SOT-23-5

VOUTA 1

VINA– 2

VINA+ 3

VSS 4

8 VDD VIN+ 1

7 VOUTB VSS 2

6 VINB– VIN– 3

5 VINB+

5 VDD

4 VOUT

MCP6402

2x3 TDFN

MCP6404

SOIC, TSSOP

VOUTA 1

8 VDD VOUTA 1

VINA– 2 EP 7 VOUTB VINA– 2

VINA+ 3

9

6 VINB– VINA+ 3

VSS 4

5 VINB+ VDD 4

VINB+ 5

VINB– 6

VOUTB 7

14 VOUTD

13 VIND–

12 VIND+

11 VSS

10 VINC+

9 VINC–

8 VOUTC

* Includes Exposed Thermal Pad (EP); see Table 3-1.

E temp: -40°C to +125°C

H Temp Package Types

MCP6401

SOT-23-5

MCP6402

SOIC

VOUT 1

VSS 2

VIN+ 3

5 VDD VOUTA 1

VINA– 2

4 VIN– VINA+ 3

VSS 4

8 VDD

7 VOUTB

6 VINB–

5 VINB+

MCP6404

SOIC

MCP6406

SOT-23-5

VOUTA 1

VINA– 2

VINA+ 3

VDD 4

14 VOUTD

13 VIND–

12 VIND+

VOUT 1

VSS 2

VIN+ 3

11 VSS

5 VDD

4 VIN–

VINB+ 5

VINB– 6

VOUTB 7

10 VINC+

9 VINC–

8 VOUTC

MCP6407

MCP6409

SOIC

SOIC

VOUTA 1

VINA– 2

VINA+ 3

VSS 4

8 VDD VOUTA 1

7 VOUTBVINA– 2

6 VINB– VINA+ 3

5 VINB+ VDD 4

VINB+ 5

14 VOUTD

13 VIND–

12 VIND+

11 VSS

10 VINC+

VINB– 6

9 VINC–

VOUTB 7

8 VOUTC

H temp: -40°C to +150°C

DS22229D-page 2

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