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H134 查看數據表(PDF) - Hi-Sincerity Microelectronics

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H134 Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23-6L (TSOP-6) package dimension
Spec. No. : IC200401
Issued Date : 2004.03.01
Revised Date : 2009.08.12
Page No. : 8/8
SOT-23-6L(TSOP-6) Surface Mounted Package
HSMC Package Code: N
Marking:
Pin Style: 1. Vctrl 2. GND 3. Vout
4.Ictrl 5. Vsense 6. Vcc
Material:
Lead solder plating: Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class:
UL94V-0
DIM Min. Max.
A
2.70 3.12
B
2.60 3.00
C
1.40 1.80
D
0.30 0.55
E
0.00 0.10
F
0° 10°
G
1.80 2.00
H
-
1.30
I
0.10 0.21
J
0.30 0.60
K
0.6*
L
0.95*
M
0.25*
N
1.00 1.20
*: Typical, Unit: mm
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of AVANTIC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMCS assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
AVANTICS Microelectronics Corp: No. 255, Cai Lun Rd. Zhangjiang Technology Industrial Park Pudong, Shanghai, China
Tel: 86-021-61637118 Fax: 86-021-58558038
H134 Series
HSMC Product Specification

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