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FSFR1700US 查看數據表(PDF) - Fairchild Semiconductor

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FSFR1700US Datasheet PDF : 15 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In
addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. TA=25°C unless otherwise specified.
Symbol
Parameter
Min.
Max.
Unit
VDS
Maximum Drain-to-Source Voltage
(VDL-VCTR and VCTR-PG)
500
V
LVCC
Low-Side Supply Voltage
HVCC to VCTR High-Side VCC Pin to Low-Side Drain Voltage
HVCC
High-Side Floating Supply Voltage
VAR
Auto-Restart Pin Input Voltage
VCS
Current Sense (CS) Pin Input Voltage
VRT
RT Pin Input Voltage
dVCTR/dt Allowable Low-Side MOSFET Drain Voltage Slew Rate
FSFR2100US/L
PD
Total Power Dissipation(3)
FSFR1800US/L
-0.3
25.0
V
-0.3
25.0
V
-0.3
525.0
V
-0.3
LVCC
V
-5.0
1.0
V
-0.3
5.0
V
50
V/ns
12.0
11.7
W
FSFR1700US/L
Maximum Junction Temperature(4)
TJ
Recommended Operating Junction Temperature(4)
11.6
+150
°C
-40
+130
TSTG
Storage Temperature Range
-55
+150
°C
Notes:
3. Per MOSFET when both MOSFETs are conducting.
4. The maximum value of the recommended operating junction temperature is limited by thermal shutdown.
© 2009 Fairchild Semiconductor Corporation
FSFR-US Series • Rev.1.0.2
4
www.fairchildsemi.com

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