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FSFR1700XSL 查看數據表(PDF) - Fairchild Semiconductor

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FSFR1700XSL Datasheet PDF : 14 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In
addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. TA=25°C unless otherwise specified.
Symbol
Parameter
Min.
Max.
Unit
VDS
Maximum Drain-to-Source Voltage (VDL-VCTR and VCTR-PG)
500
LVCC
Low-Side Supply Voltage
-0.3
HVCC to VCTR High-Side VCC Pin to Low-Side Drain Voltage
-0.3
HVCC
High-Side Floating Supply Voltage
-0.3
VAR
Auto-Restart Pin Input Voltage
-0.3
VCS
Current-Sense (CS) Pin Input Voltage
-5.0
VRT
RT Pin Input Voltage
-0.3
dVCTR/dt Allowable Low-Side MOSFET Drain Voltage Slew Rate
FSFR2100XS/L
25.0
25.0
525.0
LVCC
1.0
5.0
50
12.0
V
V
V
V
V
V
V
V/ns
PD
Total Power Dissipation(3)
FSFR1800XS/L
FSFR1700XS/L
11.7
W
11.6
FSFR1600XS/L
Maximum Junction Temperature(4)
TJ
Recommended Operating Junction Temperature(4)
11.5
+150
°C
-40
+130
TSTG
Storage Temperature Range
MOSFET Section
-55
+150
°C
VDGR
VGS
Drain Gate Voltage (RGS=1MΩ)
Gate Source (GND) Voltage
FSFR2100XS/L
500
V
±30
V
32
IDM
Drain Current Pulsed(5)
FSFR1800XS/L
FSFR1700XS/L
23
A
20
FSFR1600XS/L
18
ID
Continuous Drain Current
Package Section
FSFR2100XS/L
FSFR1800XS/L
FSFR1700XS/L
FSFR1600XS/L
TC=25°C
TC=100°C
TC=25°C
TC=100°C
TC=25°C
TC=100°C
TC=25°C
TC=100°C
10.5
6.5
7.0
4.5
A
6.0
3.9
4.5
2.7
Torque Recommended Screw Torque
5~7
kgf·cm
Notes:
3. Per MOSFET when both MOSFETs are conducting.
4. The maximum value of the recommended operating junction temperature is limited by thermal shutdown.
5. Pulse width is limited by maximum junction temperature.
© 2010 Fairchild Semiconductor Corporation
FSFR-XS Series • Rev.1.0.1
4
www.fairchildsemi.com

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