AN17850A 查看數據表（PDF） - Panasonic Corporation
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AN17850A Datasheet PDF : 17 Pages
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Prepared
Checked
Approved
Product Specifications
AN17850A
Ref No.
F
Total Page
17
Page No.
7
(Structure Description)
Chip surface passivation SiN,
PSG,
Others (
Lead frame material
Fe group,
Cu group,
Others (
Inner lead surface process Ag plating,
Au plating,
Others (
Outer lead surface process Solder plating, Solder dip,
Others (
Chip mounting method Ag paste,
Au-Si alloy, Solder, Others (
Wire bonding method
Thermalsonic bonding,
Others (
Wire material
Mold material
Molding method
Au
Epoxy,
Transfer mold, Multiplunger mold,
Others (
Others (
Others (
Fin material
Cu Group
Others (
)1
) 2, 6
)2
)6
)3
)4
)4
)5
)5
)7
Package FP-12S
1
43
5
6
7
2
Eff. Date Eff. Date
15-AUG-03
FMSC-PSDA-002-01 REV 1
Eff. Date Eff. Date
Semiconductor Company, Matsushita Electric Industrial Co., Ltd.
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