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MAX17030GTL 查看數據表(PDF) - Maxim Integrated

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MAX17030GTL Datasheet PDF : 38 Pages
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1/2/3 Phase-Quick-PWM
IMVP-6.5 VID Controllers
4) Make the DC-DC controller ground connections as
shown in the standard application circuits. This dia-
gram can be viewed as having four separate ground
planes: input/output ground, where all the high-
power components go; the power ground plane,
where the GND pin and VDD bypass capacitor go;
the master’s analog ground plane, where sensitive
analog components, the master’s GND pin and VCC
bypass capacitor go; and the slave’s analog ground
plane, where the slave’s GND pin and VCC bypass
capacitor go. The master’s GND plane must meet
the GND plane only at a single point directly
beneath the IC. Similarly, the slave’s GND plane
must meet the GND plane only at a single point
directly beneath the IC. The respective master and
slave ground planes should connect to the high-
power output ground with a short metal trace from
GND to the source of the low-side MOSFET (the
middle of the star ground). This point must also be
very close to the output capacitor ground terminal.
5) Connect the output power planes (VCORE and sys-
tem ground planes) directly to the output filter
capacitor positive and negative terminals with multi-
ple vias. Place the entire DC-DC converter circuit as
close to the CPU as is practical.
PROCESS: BiCMOS
Chip Information
Package Information
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages.
PACKAGE TYPE PACKAGE CODE DOCUMENT NO.
40 TQFN-EP
T4055-2
21-0140
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
38 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600
© 2008 Maxim Integrated Products
is a registered trademark of Maxim Integrated Products, Inc.

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