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ST1284-02 查看數據表(PDF) - STMicroelectronics

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ST1284-02 Datasheet PDF : 6 Pages
1 2 3 4 5 6
ST1284-xxA8
PACKAGE MECHANICAL DATA
QSOP28 (Plastic)
b
D
28
1
L
A
e
a1
S
E
15
F
14
FOOTPRINT DIMENSIONS (in millimeters)
dim in mm 0.4
1.7
7.1
3.7
0.65
REF.
A
a1
b1
b
b1
D
F
e
E
L
S
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
1.55
1.75
0.061 0.069
0.10
0.25
0.004 0.010
0.20
0.30
0.008 0.012
0.18
0.25
0.007 0.010
9.80
9.98
0.386 0.393
5.79
6.20
0.228 0.244
0.64 typ.
0.025 typ.
3.80
3.98
0.15
0.157
0.40
0.90
0.016 0.035
8° max
8° max
Package General Specifications
Lead Plating
Tin-Lead
Lead Plating
Thickness
7 µm Min
20 µm Max
Lead Material
Copper Alloy
Lead Coplanarity 0.102 mm (0.004")
Body Material
Molded Epoxy
Resine
Meets UL94V.0 standard
Order code
ST1284-01A8
ST1284-01A8RL
ST1284-02A8
ST1284-02A8RL
ST1284-03A8RL
Marking
ST1284-01
ST1284-01
ST1284-02
ST1284-02
ST1284-03
Package
QSOP28
QSOP28
QSOP28
QSOP28
QSOP28
Weight
0.147 g
0.147 g
0.147 g
0.147 g
0.147 g
Delivery mode
Tube
Tape & Reel
Tube
Tape & Reel
Tape & Reel
Base qty
48
2500
48
2500
2500
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of
use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by
implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not au-
thorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners.
© 2003 STMicroelectronics - All rights reserved.
STMicroelectronics GROUP OF COMPANIES
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