LM393P8 查看數據表（PDF） - Cystech Electonics Corp.
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LM393P8 Datasheet PDF : 6 Pages
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DIP-8 Dimension
CYStech Electronics Corp.
Spec. No. : C545P8
Issued Date : 2010.12.20
Revised Date :
Page No. : 6/6
Marking:
Date
Code
LM393
□□□□
Device
Name
DIP-8 Plastic Package
CYStek Package Code : P8
DIM
Inches
Min. Max.
Millimeters
Min. Max.
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A
-
0.021
-
0.5334 c1 0.008 0.011 0.203 0.279
A1 0.015
-
0.381
-
D 0.355 0.400 9.017 10.16
A2 0.115 0.195 2.921 4.953 E 0.240 0.280 6.096 7.112
b 0.014 0.022 0.356 0.559 E1 0.300 0.325 7.620 8.255
b1 0.014 0.020 0.356 0.508 e
0.100 BSC
2.540BSC
b2 0.045 0.046 1.143 1.778 HE
-
0.430
-
10.92
b3 0.030 0.045 0.762 1.143 L 0.115 0.150 2.921 3.810
c 0.008 0.014 0.203 0.356
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
• Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
• CYStek reserves the right to make changes to its products without notice.
• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
LM393P8
CYStek Product Specification
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