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MTW14N50E 查看數據表(PDF) - ON Semiconductor

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MTW14N50E Datasheet PDF : 8 Pages
1 2 3 4 5 6 7 8
MTW14N50E
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic
Symbol
Min
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
(VGS = 0 V, ID = 250 µAdc)
Temperature Coefficient (Positive)
V(BR)DSS
500
Zero Gate Voltage Drain Current
(VDS = 500 Vdc, VGS = 0)
(VDS = 500 Vdc, VGS = 0, TJ = 125°C)
Gate–Body Leakage Current (VGS = ±20 Vdc, VDS = 0)
IDSS
IGSS
ON CHARACTERISTICS (Note 1.)
Gate Threshold Voltage
(VDS = VGS, ID = 250 µAdc)
Temperature Coefficient (Negative)
VGS(th)
2.0
Static Drain–Source On–Resistance (VGS = 10 Vdc, ID = 7.0 Adc)
Drain–Source On–Voltage (VGS = 10 Vdc)
(ID = 14 Adc)
(ID = 7.0 Adc, TJ = 125°C)
Forward Transconductance (VDS = 15 Vdc, ID = 7.0 Adc)
RDS(on)
VDS(on)
gFS
5.0
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
(VDS = 25 Vdc, VGS = 0,
f = 1.0 MHz)
Ciss
Coss
Crss
SWITCHING CHARACTERISTICS (Notes 1. & 2.)
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
(VDD = 250 Vdc, ID = 14 Adc,
VGS = 10 Vdc,
RG = 4.7 )
Gate Charge
(VDS = 400 Vdc, ID = 14 Adc,
VGS = 10 Vdc)
td(on)
tr
td(off)
tf
QT
Q1
Q2
Q3
SOURCE–DRAIN DIODE CHARACTERISTICS (Note 1.)
Forward On–Voltage
(IS = 14 Adc, VGS = 0)
VSD
(IS = 14 Adc, VGS = 0, TJ = 125°C)
Reverse Recovery Time
trr
(IS = 14 Adc, VGS = 0,
dIS/dt = 100 A/µs, VGS = 0)
ta
tb
Reverse Recovery Stored Charge
QRR
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from the drain lead 0.25from package to center of die)
LD
Internal Source Inductance
LS
(Measured from the source lead 0.25from package to source bond pad)
1. Pulse Test: Pulse Width 300 µs, Duty Cycle 2%.
2. Switching characteristics are independent of operating junction temperature.
Typ
Max
Unit
Vdc
520
mV/°C
µAdc
250
1000
100
nAdc
3.2
4.0
Vdc
7.0
mV/°C
0.32
0.40
Ohm
Vdc
6.7
5.6
mhos
2510
3510
pF
280
392
67
94
28
60
ns
80
160
80
160
60
120
65
85
nC
17
47
34
1.0
1.6
Vdc
0.9
390
ns
245
145
5.35
µC
5.0
nH
13
nH
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