MTW14N50E
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Characteristic
Symbol
Min
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
(VGS = 0 V, ID = 250 µAdc)
Temperature Coefficient (Positive)
V(BR)DSS
500
–
Zero Gate Voltage Drain Current
(VDS = 500 Vdc, VGS = 0)
(VDS = 500 Vdc, VGS = 0, TJ = 125°C)
Gate–Body Leakage Current (VGS = ±20 Vdc, VDS = 0)
IDSS
–
–
IGSS
–
ON CHARACTERISTICS (Note 1.)
Gate Threshold Voltage
(VDS = VGS, ID = 250 µAdc)
Temperature Coefficient (Negative)
VGS(th)
2.0
–
Static Drain–Source On–Resistance (VGS = 10 Vdc, ID = 7.0 Adc)
Drain–Source On–Voltage (VGS = 10 Vdc)
(ID = 14 Adc)
(ID = 7.0 Adc, TJ = 125°C)
Forward Transconductance (VDS = 15 Vdc, ID = 7.0 Adc)
RDS(on)
–
VDS(on)
–
–
gFS
5.0
DYNAMIC CHARACTERISTICS
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
(VDS = 25 Vdc, VGS = 0,
f = 1.0 MHz)
Ciss
–
Coss
–
Crss
–
SWITCHING CHARACTERISTICS (Notes 1. & 2.)
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
(VDD = 250 Vdc, ID = 14 Adc,
VGS = 10 Vdc,
RG = 4.7 Ω)
Gate Charge
(VDS = 400 Vdc, ID = 14 Adc,
VGS = 10 Vdc)
td(on)
–
tr
–
td(off)
–
tf
–
QT
–
Q1
–
Q2
–
Q3
–
SOURCE–DRAIN DIODE CHARACTERISTICS (Note 1.)
Forward On–Voltage
(IS = 14 Adc, VGS = 0)
VSD
–
(IS = 14 Adc, VGS = 0, TJ = 125°C)
–
Reverse Recovery Time
trr
–
(IS = 14 Adc, VGS = 0,
dIS/dt = 100 A/µs, VGS = 0)
ta
–
tb
–
Reverse Recovery Stored Charge
QRR
–
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from the drain lead 0.25″ from package to center of die)
LD
–
Internal Source Inductance
LS
–
(Measured from the source lead 0.25″ from package to source bond pad)
1. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2%.
2. Switching characteristics are independent of operating junction temperature.
Typ
Max
Unit
–
–
Vdc
520
–
mV/°C
µAdc
–
250
–
1000
–
100
nAdc
3.2
4.0
Vdc
7.0
–
mV/°C
0.32
0.40
Ohm
Vdc
–
6.7
–
5.6
–
–
mhos
2510
3510
pF
280
392
67
94
28
60
ns
80
160
80
160
60
120
65
85
nC
17
–
47
–
34
–
1.0
1.6
Vdc
0.9
–
390
–
ns
245
–
145
–
5.35
–
µC
5.0
–
nH
13
–
nH
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