HS-1840RH 查看數據表（PDF） - Intersil

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HS-1840RH

Rad-Hard 16 Channel CMOS Analog Multiplexer with High-Z Analog Input Protection

Intersil 

HS-1840RH

Harris - Space Level Product Flow

SEM - Traceable to Diffusion Method 2018, Modified

Room Temperature Electrical Tests (T1)

This device does not meet MIL-STD-883 Method 2018.3 Class

S minimum metal step coverage of 50%. The metal does meet

the intent of the Class S requirement by meeting the current

density requirement of <2E5 A/cm2. Calculation based on con-

tinuous current of 10mA. Data can be provided upon request.

Wafer Lot Acceptance Method 5007

Internal Visual Inspection (Note 1)

Gamma Radiation Assurance Tests Method 1019

100% Nondestructive Bond Pull Method 2023

Customer Pre-Cap Visual Inspection (Notes 1, 2)

Temperature Cycling Method 1010 Condition C

Constant Acceleration Method 2001 Y1 30KG

Particle Impact Noise Detection Method 2020,

Condition A 20G

Marking and Serialization

X-Ray Inspection Method 2012

Initial Electrical Tests (T0)

Static Burn-In 72 Hour, +125oC (Min) Method 1015

Condition A

Burn-In Delta Calculation (T0-T1)

PDA Calculation 3% Functional

5% Subgroups 1, 7, ∆

Dynamic Burn-In 240 Hours at +125oC or equivalent

Method 1015 Condition A

Electrical Tests Subgroups 1, 7, 9 (T2)

Burn-In Delta Calculation (T0 - T2)

PDA Calculation 3% Functional

5% Subgroups 1, 7, ∆

Electrical Test +125oC, -55oC

Alternate Group A Inspection Method 5005

Fine and Gross Leak Tests Method 1014

Customer Source Inspection (Note 2)

Group B Inspection (Notes 2, 4) Method 5005

Group D Inspection (Notes 2, 4) Method 5005

External Visual Inspection Method 2009

Data Package Generation (Note 3)

NOTES:

1. Visual Inspection is performed to MIL-STD-883 Method 2010, Condition A.

2. These steps are optional, and should be listed on the purchase order if required.

3. Data package contains: Assembly Attributes (post seal)

Test Attributes (includes Group A) -55oC, +25oC, +125oC

Shippable Serial Number List

Radiation Testing Certificate of Conformance

Wafer Lot Acceptance Report (includes SEM report)

X-Ray Report and Film

Test Variables Data, (Table 5 Parameters only)

+25oC Initial Test

+25oC Interim Test 1

+25oC Interim Test 2

+25oC Delta Over Burn-In

4. Group B data package contains Attributes Data and Variables Data, (Table 5 Parameters only). Group D data package contains Attributes only.

Harris -8 Product Flow

Internal Visual Inspection, Alternate Condition B (Note 1)

Gamma Radiation Assurance Tests Method 1019

Customer Pre-Cap Visual Inspection (Notes 1, 2)

Temperature Cycling Method 1010 Condition C (50 Cycles)

Constant Acceleration Method 2001 Y1 30kG

Fine and Gross Leak Tests Method 1014

Marking

Initial Electrical Tests (T0)

Dynamic Burn-In 160 Hours, +125oC Method 1015 or

Equivalent Condition D

Electrical Tests Subgroups 1, 7, 9 (T1) Method 5004

PDA Calculation 5% Subgroups 1, 7 Method 5004

Electrical Test +125oC, -55oC Method 5004

Alternate Group A Inspection Method 5005

Customer Source Inspection (Note 2)

Group B Inspection (Notes 2, 4) Method 5005 (Optional)

Group C Inspection (Notes 2, 4) Method 5005 (Optional)

Group D Inspection (Notes 2, 4) Method 5005 (Optional)

External Visual Inspection Method 2009

Data Package Generation (Note 3)

NOTES:

1. Visual inspection is performed to MIL-STD-883 Method 2010, Alternate Condition B.

2. These steps are optional, and should be listed on the purchase order if required.

3. Data Package Contents:

Test Attributes (including Group A) -55oC, +25oC, +125oC

Radiation Testing Certificate of Conformance

4. Group B, C and D data package contains Attributes Data only.

Spec Number 518022

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