MC3411A 查看數據表（PDF） - Unspecified

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MC3411A

16 SEGMENT X 12 GRID VFD DRIVER WITH KEYSCAN

Unspecified 

MC3401A/3411A

NOTE:

QFN Type Package has a bonding pad at the bottom. Bonding pad exists

outside. This is to improve heat radiating for IC. Also this is connected to

substrate. Generally Substrate is connected to lowest voltage of IC. Lowest

level is VEE.

Therefore, Do not connect to VSS. Also You don’t need to connect to

anywhere or if you want to connect, you must connect to VEE.

February 28, 2013 Ver. 1.10

4/29

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