AD8390A 查看數據表（PDF） - Analog Devices

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AD8390A

Low Power, High Output Current Differential Amplifier

Analog Devices 

AD8390A

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Supply Voltage (VCC − VEE)

VCOM

Package Power Dissipation

Maximum Junction Temperature (TJ MAX)

Operating Temperature Range (TA)

Storage Temperature Range

Lead Temperature (Soldering, 10 sec)

Rating

26 V

VEE < VCOM < VCC

See Figure 2

150°C

–40°C to +85°C

–65°C to +150°C

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

θJA is specified in still air with exposed pad soldered to 4-layer

JEDEC test board. θJC is specified at the exposed pad.

Table 3. Thermal Resistance

Package Type

θJA

θJC

16-Lead LFCSP (CP-16-4)

30.4 16

Unit

°C/W

MAXIMUM POWER DISSIPATION

The maximum safe power dissipation for the AD8390A is

limited by its junction temperature on the die.

The maximum safe junction temperature of plastic encapsu-

lated devices, as determined by the glass transition temperature

of the plastic, is 150°C. Exceeding this limit temporarily may

cause a shift in the parametric performance due to a change in

the stresses exerted on the die by the package. Exceeding this

limit for an extended period can result in device failure.

Figure 2 shows the maximum safe power dissipation in

the package vs. the ambient temperature. θJA values are

approximations.

Data Sheet

3.5

TJ = 150°C

3.0

2.5

2.0

1.5

1.0

0.5

0

–25 –15 –5 5 15 25 35 45 55 65 75 85

AMBIENT TEMPERATURE (°C)

Figure 2. Maximum Power Dissipation vs. Temperature

The power dissipated in the package (PD) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power is the voltage between the supply pins (VS) times the

quiescent current (IS). Assuming that the load RL is referenced

to midsupply, the total drive power is VS/2 × IOUT, part of which

is dissipated in the package and part in the load (VOUT × IOUT).

RMS output voltages should be considered. If RL is referenced to

VEE as in single-supply operation, the total power is VS × IOUT.

In single-supply operation with RL referenced to VEE, the worst

case is VOUT = VS/2.

Airflow increases heat dissipation, effectively reducing θJA. In

addition, more copper in direct contact with the package leads

from PCB traces, through holes, ground, and power planes

reduces θJA.

ESD CAUTION

Rev. B | Page 4 of 12

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