Also Offering
RoHs Compliant
Surface Mount Low Power
Step Recovery Diodes
Mounting Information
The illustration indicates the recommended
mounting pad configuration for the
SOT-23 and SC-79 packages. Solder paste
containing flux should be screened onto the pads to
a thickness of 0.005- 0.007 inches. The plastic
package is placed in position, firmly adhering to the
solder paste.
Permanent attachment is performed by a reflow
soldering procedure during which the tab
temperature does not exceed +275 °C and the body
temperature does not exceed +250 °C, for standard
models and +260 °C for the RoHS compliant
devices.
Please refer to Application Note M538 for surface
mounting instructions.
Package Configuration
MA44700 Series
V4
SOT-23
.030 min.
0.80
.035 min.
0.90
.090
2.2
.037
0.95
0.75
1.9
Dimenstions: inches
mm
SC-79
0.020
0.50
0.020
0.50
0.053
1.35
Dimenstions:inches
mm
SOT-23
Case Style 287
SC-79
Case Style 1279
3
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product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
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