RF2126 查看數據表（PDF） - RF Micro Devices

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RF2126

HIGH POWER LINEAR AMPLIFIER

RF Micro Devices 

RF2126

Pin Function Description

Interface Schematic

2

1

RF IN

RF input. This input is DC coupled, so an external blocking capacitor is

required if this pin is connected to a DC path. An optimum match to 50Ω is

obtained by providing an external series capacitor of 1.8pF and then a

shunt capacitor of 1.3pF; see the Application Schematic. Those values are

typical for 2450MHz; other values may be required for other frequencies.

2

RF IN

Same as pin 1.

3

PC

Power control pin. For obtaining maximum performance the voltage on this

pin can be used to set correct bias level. In a typical application this is

implemented by a feedback loop. The feedback can be based on the actual

supply current of the device, i.e. maintaining a fixed current level, or it can

be based on the RF output power level to maintain a fixed RF power level

(Automatic Level Control loop). A voltage of 0.5V or lower brings the part

into power down state.

4

VCC

Power supply pin for the bias circuits. External low frequency bypass capac-

itors should be connected if no other low frequency decoupling is nearby.

5

RF OUT

RF output and bias for the output stage. The power supply for the output

transistor needs to be supplied to this pin. This can be done through a

quarter-wavelength microstrip line that is RF grounded at the other end, or

through an RF inductor that supports the required DC currents. Optimum

load impedance is achieved by providing a shunt capacitor of 1.8pF and a

series capacitor of 3.3pF; see the Application Schematic. Those values are

typical for 2450MHz; other values may be required for other frequencies.

Since there are several output pins available, which are internally con-

nected, one pin can be used for connecting the bias, another for connect-

ing a (third) harmonic trap filter, and the other pins for the RF output.

6

RF OUT Same as pin 5.

7

RF OUT Same as pin 5.

8

RF OUT Same as pin 5.

Pkg

Base

GND

Ground connection. The backside of the package should be connected to

the ground plane through a short path, i.e., vias under the device may be

required.

Package Drawing

0.157

0.150

0.0192

0.0138

-A-

0.004

0.002

0.196

0.189

0.050

0.244

0.230

Shaded lead is pin 1.

0.123

0.107

0.087

0.071

0.065

0.055

EXPOSED

HEATSINK

8° MAX

0° MIN

0.035

0.016

0.0098

0.0075

7628 Thorndike Road, Greensboro, NC 27409-9421 · For sales or technical

2-6

support, contact RFMD at (+1) 336-678-5570 or sales-support@rfmd.com.

Rev A14 DS070511

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