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PCF2123_11 查看數據表(PDF) - NXP Semiconductors.

零件编号
产品描述 (功能)
生产厂家
PCF2123_11
NXP
NXP Semiconductors. NXP
PCF2123_11 Datasheet PDF : 2 Pages
1 2
The calendar functions track year, month, weekday, and day
with built-in Leap Year correction. The programmable alarm and
timer function gives the option of generating a wake-up signal
on an interrupt pin.
In the PCF2123, the Watchdog timer can be used to wake
a microcontroller from hibernation mode or monitor
microcontroller tasks independently.
PCF8523 block diagram
PCF2123 block diagram
Selection guide
Characteristics
Interface
Temperature range
Supply voltage VDD clock
Supply voltage VDD interface
Supply current at VDD = 2 V
Electronic tuning
Ordering Information
Type
PCF8523T/1
PCF8523TS/1
PCF8523TK /1
PCF2123TS/1
PCF2123BS/1
PCF2123U/10A A /1
PCF2123U/12 A A /1
PCF2123U/12HA/1
PCF8523U/12 A A /1
PCF8523
I2C
-40º to +85 °C
1.2 to 5.5 V
1.6 to 5.5 V
100 nA
yes
PCF2123
SPI
-40º to +85 ºC
1.1 V to 5.5 V
1.6 V to 5.5 V
100 nA
yes
PCF85(1)63
I2C
-40 to +85 °C
1.0 to 5.5 V
1.8 to 5.5 V
270 nA
no
PCA21125
SPI
-40 to +125 °C
1.3 to 5.5 V
1.6 to 5.5 V
640 nA
no
Package tape and reel
SO8, plastic small outline package; 8 leads; body width 3.9 mm
TSSOP14, plastic thin shrink small outline package; 14 leads; body width 4.4 mm
HVSON8, plastic thermal enhanced very thin small outline package; no leads; 8 terminals; 4 x
4 x 0.85 mm
TSSOP14, plastic thin shrink small outline package, 14 leads; body width 4.4 mm
HVQFN16, plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body
3 x 3 x 0.85 mm
Bare die, die thickness 200 µm
Bare die with gold bumps, die thickness 200 µm
Bare die with gold bumps, die thickness 150 µm
Bare die with gold bumps, die thickness 200 µm
Type
SOT96-1
SOT402-1
SOT909-1
SOT402-1
SOT758-1
-
-
-
-
PCA8565
I2C
-40 to +125 °C
1.0 to 5.5 V
1.8 to 5.5 V
600 nA
no
Version
1
1
1
1
1
1
1
1
1
www.nxp.com
© 2011 NXP Semiconductors N.V.
All rights reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable
and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Date of release: March 2011
Document order number : 9397 750 17076
Printed in the Netherlands

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