HCPL-2601 查看數據表（PDF） - Fairchild Semiconductor
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HCPL-2601 Datasheet PDF : 12 Pages
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Package Dimensions (Through Hole)
4
3
5
6
2
1
7
8
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
0.200 (5.08)
0.140 (3.55)
0.022 (0.56)
0.016 (0.41)
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.020 (0.51) MIN
0.154 (3.90)
0.120 (3.05)
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
15° MAX
0.300 (7.62)
TYP
Package Dimensions (Surface Mount)
0.390 (9.91)
0.370 (9.40)
4
3
2
1
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.070 (1.78)
0.045 (1.14)
0.300 (7.62)
TYP
0.020 (0.51)
MIN
0.016 (0.41)
0.008 (0.20)
0.022 (0.56)
0.016 (0.41)
0.100 (2.54)
TYP
Lead Coplanarity : 0.004 (0.10) MAX
0.045 [1.14]
0.315 (8.00)
MIN
0.405 (10.30)
MIN
Package Dimensions (0.4"Lead Spacing)
4
3
2
1
PIN 1
ID.
0.270 (6.86)
0.250 (6.35)
5
6
7
8
0.200 (5.08)
0.140 (3.55)
0.022 (0.56)
0.016 (0.41)
0.390 (9.91)
0.370 (9.40)
0.070 (1.78)
0.045 (1.14)
0.004 (0.10) MIN
0.154 (3.90)
0.120 (3.05)
0.100 (2.54) TYP
0.016 (0.40)
0.008 (0.20)
NOTE
All dimensions are in inches (millimeters)
0° to 15°
0.400 (10.16)
TYP
Recommended Pad Layout for
Surface Mount Leadform
0.070 (1.78)
0.060 (1.52)
0.295 (7.49)
0.415 (10.54)
0.100 (2.54)
0.030 (0.76)
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Single-Channel: 6N137, HCPL-2601, HCPL-2611 Dual-Channel: HCPL-2630, HCPL-2631 Rev. 1.0.5
www.fairchildsemi.com
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