HCPL-0710-300E 查看數據表（PDF） - HP => Agilent Technologies

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HCPL-0710-300E

40 ns Propagation Delay, CMOS Optocoupler

HP => Agilent Technologies 

Agilent HCPL-7710, HCPL-0710

40 ns Propagation Delay,

CMOS Optocoupler

Data Sheet

Description

Available in either an 8-pin DIP or

SO-8 package style respectively,

the HCPL-7710 or HCPL-0710

optocouplers utilize the latest

CMOS IC technology to achieve

outstanding performance with

very low power consumption. The

HCPL-x710 require only two

bypass capacitors for complete

CMOS compatibility.

Basic building blocks of the

HCPL-x710 are a CMOS LED

driver IC, a high speed LED and a

CMOS detector IC. A CMOS logic

input signal controls the LED

driver IC which supplies current

to the LED. The detector IC

incorporates an integrated

photodiode, a high-speed

transimpedance amplifier, and a

voltage comparator with an

output driver.

Functional Diagram

**VDD1 1

VI 2

*3

GND1 4

LED1

SHIELD

8 VDD2**

7 NC*

IO

6 VO

TRUTH TABLE

(POSITIVE LOGIC)

VI, INPUT

H

L

LED1

OFF

ON

VO, OUTPUT

H

L

5 GND2

Features

• +5 V CMOS compatibility

• 8 ns maximum pulse width

distortion

• 20 ns maximum prop. delay skew

• High speed: 12 Mbd

• 40 ns maximum prop. delay

• 10 kV/µs minimum common mode

rejection

• -40°C to 100°C temperature range

• Safety and regulatory approvals

UL Recognized

3750 V rms for 1 min. per

UL 1577

CSA Component Acceptance

Notice #5

IEC/EN/DIN EN 60747-5-2

– VIORM = 630 Vpeak for

HCPL-7710 Option 060

– VIORM = 560 Vpeak for

HCPL-0710 Option 060

Applications

• Digital fieldbus isolation:

DeviceNet, SDS, Profibus

• AC plasma display panel level

shifting

• Multiplexed data transmission

• Computer peripheral interface

• Microprocessor system interface

* Pin 3 is the anode of the internal LED and must be left unconnected for guaranteed data sheet

performance. Pin 7 is not connected internally.

** A 0.1 µF bypass capacitor must be connected between pins 1 and 4, and 5 and 8.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this

component to prevent damage and/or degradation which may be induced by ESD.

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