HCPL-0710-300 查看數據表（PDF） - HP => Agilent Technologies

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HCPL-0710-300

40 ns Propagation Delay, CMOS Optocoupler

HP => Agilent Technologies 

Solder Reflow Thermal Profile

300

PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.

REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC. PEAK

TEMP.

245°C

200

160°C

150°C

140°C

100

2.5°C ± 0.5°C/SEC.

3°C + 1°C/–0.5°C

PREHEATING TIME

150°C, 90 + 30 SEC.

30

SEC.

30

SEC.

PEAK

TEMP.

240°C

PEAK

TEMP.

230°C

SOLDERING

TIME

200°C

50 SEC.

ROOM

TEMPERATURE

0

0

TIGHT

TYPICAL

LOOSE

50

100

150

200

250

TIME (SECONDS)

Recommended Pb-Free IR Profile

tp

Tp

TL 217 °C

260 +0/-5 °C

RAMP-UP

3 °C/SEC. MAX.

Tsmax 150 - 200 °C

Tsmin

ts

PREHEAT

tL

60 to 180 SEC.

TIME WITHIN 5 °C of ACTUAL

PEAK TEMPERATURE

20-40 SEC.

RAMP-DOWN

6 °C/SEC. MAX.

60 to 150 SEC.

25

t 25 °C to PEAK

TIME

NOTES:

THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.

Tsmax = 200 °C, Tsmin = 150 °C

Regulatory Information

The HCPL-x710 have been

approved by the following

organizations:

UL

Recognized under UL 1577,

component recognition program,

File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

IEC/EN/DIN EN 60747-5-2

Approved under:

IEC 60747-5-2:1997 + A1:2002

EN 60747-5-2:2001 + A1:2002

DIN EN 60747-5-2 (VDE 0884

Teil 2):2003-01.

(Option 060 only)

Insulation and Safety Related Specifications

Value

Parameter

Symbol 7710 0710

Minimum External Air

Gap (Clearance)

L(I01)

7.1

4.9

Minimum External

Tracking (Creepage)

L(I02) 7.4

4.8

Minimum Internal Plastic

Gap (Internal Clearance)

0.08 0.08

Tracking Resistance

(Comparative Tracking

Index)

Isolation Group

CTI

≥175 ≥175

IIIa

IIIa

Units

mm

mm

mm

Volts

Conditions

Measured from input terminals to output

terminals, shortest distance through air.

Measured from input terminals to output

terminals, shortest distance path along

body.

Insulation thickness between emitter and

detector; also known as distance through

insulation.

DIN IEC 112/VDE 0303 Part 1

Material Group (DIN VDE 0110, 1/89,

Table 1)

All Agilent data sheets report the

creepage and clearance inherent

to the optocoupler component

itself. These dimensions are

needed as a starting point for the

equipment designer when

determining the circuit insulation

requirements. However, once

mounted on a printed circuit

4

board, minimum creepage and

clearance requirements must be

met as specified for individual

equipment standards. For

creepage, the shortest distance

path along the surface of a

printed circuit board between the

solder fillets of the input and

output leads must be considered.

There are recommended

techniques such as grooves and

ribs which may be used on a

printed circuit board to achieve

desired creepage and clearances.

Creepage and clearance distances

will also change depending on

factors such as pollution degree

and insulation level.

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