HSMY-H690 查看數據表（PDF） - HP => Agilent Technologies

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HSMY-H690

Surface Mount Flip Chip LEDs

HP => Agilent Technologies 

Package Dimensions

HSMX-H670 Series

CATHODE MARK

HSMX-H690 Series

POLARITY

0.40

(0.016)

2.00

(0.079)

1.27

(0.050)

POLARITY

1.10

(0.043)

0.50 (0.020)

0.40 (0.016)

0.48 (0.019)

1.25

(0.049)

,
1.00

0.60

0.30

0.80

1.60

BOTTOMSIDE CATHODE MARK

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS (INCHES).

2. TOLERANCE, UNLESS OTHERWISE SPECIFIED, ± 0.1 mm (± 0.004 INCH).

3. THE LEADS ARE GOLD PLATED; PLATING THICKNESS IS: GOLD – 0.05

MICRONS, NICKEL – 3 MICRONS, COPPER –18 MICRONS.

TOPSIDE

CATHODE

MARK

Absolute Maximum Ratings at TA = 25°C

Parameter

HSMX-H670

DC Forward Current[1]

20

Power Dissipation

50

Reverse Voltage (IR = 100 µA)

Operating Temperature Range

5

-40 to +85

Storage Temperature Range[2]

-40 to +85

Notes:

1. Derate linearly as shown in Figure 4 for temperatures above 25°C.

2. Maximum temperature for tape and reel packaging is 60°C.

HSMX-H690

20

50

5

-40 to +85

-40 to +85

Units

mA

mW

V

°C

°C

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