HSMS-H690 查看數據表（PDF） - HP => Agilent Technologies

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HSMS-H690

Surface Mount Flip Chip LEDs

HP => Agilent Technologies 

,
,
,
,
,
 ,
,
, DIM.A

,
,
,
,
,
,
 (SEE TABLE 1)

4.00 ± 0.10

(0.157 ± 0.004)

1.50 + 0.10

Ø

0

(0.059 + 0.004)

0

CATHODE

1.30 ± 0.10

(0.051 ± 0.004)

1.75 ± 0.10

(0.069 ± 0.004)

3.50 ± 0.05

(0.138 ± 0.002)

8.00 ± 0.30

(0.315 ± 0.012)

0.20 ± 0.05

(0.008 ± 0.002)

DIM. B

(SEE TABLE 1)

2.00 ± 0.05

(0.079 ± 0.002)

4.00 ± 0.10

(0.157 ± 0.004)

USER FEED

DIRECTION

TABLE 1

DIMENSIONS IN MILLIMETERS (INCHES)

CARRIER TAPE

COVER TAPE

DIM. A

DIM. B

PART NUMBER ± 0.10 (0.004) ± 0.10 (0.004)

HSMX-H670 SERIES 2.40 (0.094) 1.60 (0.064)

HSMX-H690 SERIES 1.98 (0.078) 1.02 (0.040)

Figure 10. Tape Dimensions.

END

START

THERE SHALL BE A

MOUNTED WITH

MINIMUM OF 40 mm

COMPONENTS

(1.57 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

THERE SHALL BE A

MINIMUM OF 40 mm

(1.57 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

150 mm-360 mm

(5.9 - 14.2 INCH)

MAY CONSIST

OF CARRIER

AND/OR

COVER TAPE.

Figure 11. Tape Leader and Trailer Dimensions.

Convective IR Reflow

Soldering

For information on IR reflow

soldering, refer to Application

Note 1060, Surface Mounting

SMI LED Indicator

Components.

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